Innovation science and technologiy Volume 1 Issue 11 (2025)
STRUCTURE–PROPERTY RELATIONSHIP OF ORGANOSILICON MATERIALS: EVALUATION BASED ON THERMOGRAVIMETRIC ANALYSIS
Tosheva, Dilfuza, Siddikov, Ikrom, Rakhimov, Firuz
Abstract
This article presents a comprehensive scientific evaluation of the structure–property relationships oforganosilicon materials using thermogravimetric analysis (TGA). Due to the high bond energy of the –Si–O– linkage,polyorganosiloxanes and their derivatives exhibit remarkable thermal stability at elevated temperatures. By applying TGAand DTG methods, the decomposition stages, onset and peak temperatures, residual mass, and decomposition rate ofthe materials were accurately determined. Kinetic analyses based on the Kissinger and Flynn–Wall–Ozawa methods wereconducted to calculate the activation energy and assess the influence of structural parameters on thermal performance.The results confirm that the thermal resistance of organosilicon materials directly depends on the chemical nature of sidegroups, the degree of molecular branching, and the incorporation of nanofillers.
organosilicon materials, thermogravimetric analysis, structure–property relationship, thermal stability, activation energy, nanofillers
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